製造企業常用到的英文縮寫釋義

1. 5M﹕Man(人) Machine(機器) Material(材料) Method(方法) Measurement(測量)

2. 5W1H﹕When(何時) Where(何地) Who(何人) What(何事) Why(為何) How(如何)

3. ACC﹕Accept(允收)

4. AQL: Acceptable Quality Level(允收品質水準)

5. ASAP: As Soon As Possible(儘快)

6.AQQ﹕Average Outgoing Quality(平均出廠品質)

8. BOM﹕Bill Of Material(物料清單)

9. BTO﹕Build To Order(按單生產)

10. C/T﹕Cycle Time(製程週期)

11. CAD﹕Computer Aided Design(計算機輔助設計)

12. CAE﹕Computer Aided Engineering(計算機輔助工程)

13. CAM﹕Computer Aided Manufacturing(計算機輔助製造)

14. CAR﹕Correction Active Report(改善行動報告)

15. DDP﹕Delivery Duty Paid(賣方負擔運費及關稅)

16. STS﹕Ship To Stock(免檢入庫)

17. DQA﹕Design Quality Assurance(設計品質保證)

18. DR﹕Design Review(設計審查)

19. ECN﹕Engineering Change Notice(工程變更通知)

20. ECR﹕Engineering Change Request(工程變更需求)

21.ETA﹕Estimate date of Arrive(預估到貨日)

22. ETD﹕Estimate date of Department(預估出貨日)

23. FAE﹕Field Application Engineer(應用工程師)

24. FAIR﹕First Article Inspection Report(初件檢驗報告)

25. FEA﹕Finite Elements Analysis(有限元素分析)

26. FIFO﹕First In & First Out(先進先出)

27. FMEA﹕Failure Mode Effects Analysis(失效模式分析)

28. FOB﹕Free On Board(離岸價格)

29. FQC﹕Final Quality Control(最終品質管制)

30. GQIS﹕Global Quality Information system(全球品質信息系統)

31. IE﹕Industry Engineer(工業工程)

32. IC﹕Integrated Circuit(集成電路)

33. IPQC﹕In Process Quality Control(製程品質管制)

34. IQC﹕Incoming Quality Control(進料品質管制)

35. IR﹕Infra Red(紅外線)

36. ISO﹕International standardization Organization(國際標準組織)

37. IT﹕Information Technology(信息技朮)

38. JIS﹕Japanese Industrial Standard(日本工業標準)

39. JIT﹕Just In Time(及時)

40. L/T: Lead time(前置時間)

41. LLCR﹕Low Level Contact Resistance(低功率接觸阻抗)

42. LQA﹕Laboratories Quality Assurance(試驗室品質保證)

43. MAJ﹕Major Defect(主要缺點)

44. MFP﹕Multi Function Product(多功能產品)

45. OEM﹕Original Equipment Manufacture(原始設備製造)

46. ODM﹕Optimized Distribution Model(最佳配置模型)

47. MIN﹕Minor Defect(次要缺點)

48. MQA﹕Manufacture Quality Assurance(製造品質保證)

49. MRB﹕Material Review Board(來料不良及時處理團隊)

50. MRP﹕Material Require Planning(物料需求計劃)

或Manufacturing Resource Planning(製造資源規劃)

51. P/N﹕Part Number(料號)

52. PCB﹕Printed circuit Board(印刷電路板)

53. PDCA﹕Plan(計劃) Do(執行) Check(檢討) Action(改善)(戴明循環)

54. PDM﹕Product Data Management(產品數據管理)

55. PDT﹕Product Design Team(產品設計團隊)

56. PM﹕Product Marketing(產品市場)或Project Management(項目管理)

57. PMP﹕Process Manufacture Plan(產品製程計劃)

58. PMT﹕Product Management Team(產品經營團隊)

59. PO Balance﹕Purchase Order Balance(先有未銷(交)訂單明細)

60. PPM﹕Parts Per Million(百萬分之幾)

61. QTY﹕Quantity(數量)

62. QA﹕Quality Assurance(品質保證)

63. QAN﹕Quality Action Notice(品質改善行動通知)

64. QCC﹕Quality Control Circle(品質)

65. QE﹕Quality Engineer(品質工程)

66. QIT﹕Quality Improvement Team(品質改善小組)

67. R&D﹕Research And Development(研究與發展﹕研究)

68. REJ﹕Reject(拒收)

69. REV﹕Revision(修訂﹑版次)

70. REI﹕Radio Frequency Interference(射頻干擾)

71. RFQ﹕Request For Quotation(詢價需求)

72. RMS﹕Root Mean Square(均方根(有效值))

73. S/T﹕Standard Time(標準時間)

74. SMT﹕Surface Mounting Technology(表面粘著技朮)

75. SCR﹕Supplier Change Request(供貨商變更需求)

76. SOP﹕Standard Operation Procedure(標準作業規範)

77. SPC﹕Statistical Process Control(統計製程管制)

78. SPEC﹕Specification(規格)

79. SSQA﹕Standard Supplier Quality Assessment(標準供貨商品質評監)

80. TIP﹕Tip Innovation Plan(提案改善計劃)

81. TPM﹕Total Production Maintenance(全面生產保養)

82. TQA﹕Total Quality Assurance(全面品質保證)

83. TQC﹕Total Quality Control(全面品質管制)

84. TQM﹕Total Quality Management(全面品質管理)

85. UL﹕Underwriters Laboratories Inc(美國安全協會試驗室)

86. VDCS﹕Vendor Defect Correction Sheet(廠商進料異常通知單)

87. VQA﹕Vendor Quality Assurance(供貨商品質保證)

88. VRB﹕Variance Review Board(製程異常及時處理團隊)

89. WDR﹕Weekly Delivery Requirement(周出貨需求)

90. ZD﹕Zero Defect(零缺點)

91. SCM﹕Supply Chain Management(供應鏈管理系統)

以上自己收集和提煉的常用到的英文縮寫以及含義,不知道對不對,大家可以發表意見。

製造企業常用到的英文縮寫釋義


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