Logic
Qualcomm
SDM845
Snapdragon 845 8-Core Application and Baseband Processor
Memory
Toshiba
THGAF4G9N4LBAIR
64GB NAND Flash
Memory
Samsung
K3UH6H60AM-AGCJ
6GB RAM
PM
Samsung
S2MPB03
Power Management
PM
Maxim
MAX77705F
PMIC
PM
Samsung
S2MPB02
Camera Power Management
PM
Samsung
S2ABB01
Power Management
PM
Qualcomm
PM845
Power Management
PM
Qualcomm
PM8005
Power Management
PM
Samsung
S2D0S05
Display Power Management
RF
Unknown
Unknown
Front-End Module
RF
Qualcomm
QDM3870
Front-End Module
RF
Qualcomm
QET4100
40 MHz Envelope Tracker
RF
AVAGO
AFEM-9090
Front-End Module
RF
Skyworks
SKY77365-11
Power Amplifier Module for Quad-Band GSM / GPRS / EDGE
RF
Skyworks
SKY13716-11
Low-Band LNA Front-End Module
RF
Qualcomm
SDR845
RF Transceiver
RF
Murata
Unknown
Power Amplifier
Sensor
Seiko Instruments
S-5712CCDL1
Hall Effect IC
Sensor
STMicroelectronics
LSM6DSL
6-Axis Accelerometer+Gyroscope
Sensor
AKM
AK09916C
3-axis Electronic Compass
Sensor
Unknown
Unknown
Heart Rate Sensor
Sensor
STMicroelectronics
LPS22H
Barometric Pressure Sensor
Sensor
Unknown
Unknown
Microphone
總結:
整機使用2種共22顆十字螺絲固定,未貼防拆貼紙。防水方面,屏幕、後蓋、按鍵、USB接口、耳機孔、SIM卡託、聽筒、揚聲器、麥克風等都經過防水處理;散熱方面,採用銅管、硅脂和石墨片散熱。後置攝像頭金屬蓋上貼有壓力平衡膜。防水密封處理以及兩面玻璃的設計,讓整機的拆機難度比較高,大量膠水的利用也使得整機的可修復性很低。
產品技術分析服務:
一:整機分析報告:產品技術亮點、參數信息、包裝規格、整機外觀、拆解步驟、主板/軟板分析、電池/攝像頭/顯示屏分析、成本參考信息。
二:IC器件分析報告:封裝級分析、器件工藝分析、材料結構分析、可靠性/失效實驗。
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