OD stands for the thin oxide region or active area.
STI stands for shallow trench isolation (opposite of OD)
In an OD NWELL resistor the resistor is formed in an active area. In the case of an STI NWELL resistor it is formed under the STI oxide.
The models for these two resistors will be different since they will have differnt diffusion profiles and be contacted different. The OD resistor most likely has a silicide block mask also to keep silicide from forming on top of the OD region.
• ESC: Electrical Static Chuck 靜電卡盤
• TMP: Turbo Molecule Pump 分子泵
• DP: Dry Pump 幹泵
• EPD: Endpoint Detection 終點檢測系統
• OES: Optical Emission Spectrograph 光學發射光譜儀
• IEP: Interferometer Endpoint Detection 干涉測量儀
• CTC: Cluster Tool Controller 群集設備控制器
• PMC: Process Module Controller 工藝模塊控制器
• TMC: Transfer Module Controller 傳送模塊控制器
. BT: Break Through 去除自然氧化層
• ME: Main Etch 主刻
• OE: Over Etch 過刻
• STI: Shallow Trench Isolation 淺溝槽隔離刻蝕
• PR: Photo Resist 光刻膠
• CD: Critical Dimension 關鍵尺寸
• AEI: After Etch Inspection
• ADI: After Developed Inspection
• ROX: Remaining Oxide 剩餘Oxide層厚度
• ER: Etch Rate 刻蝕速率
• EU: Etch Uniformity 刻蝕均勻性
• AEC/APC: Advanced Equipment/Process Control 先進設備/工藝控制
• PRK: Particle Reduce Kits 減少顆粒過程
• PM: Periodic Maintenance 週期維護
• CoO: Cost of Ownership
• CoC: Cost of Consumption
• PRS: Process Release Standard
• STR: Split testing release
• MSTR: Mass Split Testing Release
• WAT: Wafer Acceptance Test
• Fab: Fabrication 芯片加工廠代稱
• FA: Fab Automation 工廠自動化
• CIM: Computer Integration Manufacturing 計算機集成製造
1
WAT
Wafer Acceptance Test /晶圓測試
2
RF
Radio Frequency /射頻
3
CD
Critical Dimension /關鍵尺寸
4
Cp Yield
Yield /良率
5
PR
Photo resist /光刻膠
6
STI
Shallow trench isolation /溝槽隔離（刻蝕工藝）
7
MFC
Mass Flow Controller /質量流量計
8
ADI
After develop inspection /顯影后檢查
9
AEI
After etch inspection/刻蝕後檢查
10
CoO
Cost of Ownership /客戶擁有成本
11
CoC
Cost of Consumables /消耗成本
12
MTBF
Mean Time Between Failure /平均故障間隔時間
13
MTTR
Mean Time To Repair /機臺平均維修時間
14
MTBC
Mean Time Between Clean /平均清洗間隔時間
15
FECP
Field Equipment Change Procedure /設備合格認證流程
16
CE
Customer Engineer /客戶硬件支持工程師
17
PSE
Process Support Engineer /客戶工藝支持工程師
18
HCI
Hot Carrier Inject /熱載流子注入測試
19
EFR
Early Failure Rate /早期失效率測試
20
HTOL
Hot Temperature Operation Life 168/500/1000 Hour test/
168/500/1000小時高溫運行壽命測試
21
WPH
Wafer Per Hour /每小時加工的硅片數量
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